Thermo-Electro Mechanical Impedance based Structural Health Monitoring: Euler- Bernoulli Beam Modeling

In recent years, impedance measurement method by piezoelectric (PZT) wafer activesensor (PWAS) has been widely adopted for non-destructive evaluation (NDE). In this method, theelectrical impedance of a bonded PWAS is used to detect a structural defect. The electro-mechanicalcoupling of PZT materials constructs the original principle of this method. Accordingly, the electricalimpedance of PWAS can sense any change in the mechanical impedance of the structure. A thermalstress on a structure, which was generated by environmental temperature, could change the electricalimpedance of PWAS. The thermal stress which affects the output impedance of PWAS is alsodeveloped. A temperature-dependent model, the temperature dependency of PWAS, and structurematerial properties are investigated for a PWAS bonded to an Euler Bernoulli clamped-clamped beam.The Rayleigh-Ritz and spectral element methods are studied and, then, verified by 3D finite elementmethod (FEM).